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Electron Paramagnetic Resonance Studies of Point Defects in AlGaN and SiC

机译:AlGaN和SiC中点缺陷的电子顺磁共振研究

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摘要

Point defects in semiconductor materials are known to have important influence on the performance of electronic devices. For defect control, knowledge on the model of defects and their properties is required. Information on defects, such as the symmetry and the localization of spins, is essential for identification of defects and understanding their electronic structure. Such information can be obtained from Electron Paramagnetic Resonance (EPR). In many cases, the energy levels of defects can be determined from photoexcitation EPR (photo-EPR) or temperature dependence of the EPR signal. The thesis contains six papers, focusing on the identification and electronic structure investigation of defects and impurities in AlxGa1-xN (x~0.7-1) and silicon carbide (SiC) using EPR in combination with other electrical characterizations and density functional theory calculations. The two first papers concern EPR studies of silicon (Si) in AlGaN alloys. Due to its direct and wide band gap which can be tailored from 3.4 eV for GaN to 6.2 eV for AlN, high-Al-content wurtzite AlxGa1-xN (x≥0.7) has been considered as a promising material for fabrication of compact, high-efficiency and non-toxic deep ultraviolet light-emitting diodes (LEDs) and laser diodes (LDs) for replacing low-efficiency and toxic mercury lamps in water/air purification and sterilization. Si is commonly used for n-type doping in AlGaN and AlN, but the conductivity of Si-doped AlxGa1-xN was often reported to drop abruptly at high Al content (x>0.7) and the reason was often speculated to be due to either carrier compensation by other deep levels or Si itself when it transforms from a shallow donor to a DX (or negative-U) center which acts as an acceptor. In paper 1, we showed that Si already forms a stable DX center in AlxGa1-xN with x ~0.77. However, with the Fermi level locating only ~3 meV below the neutral charge state, Ed, Si still behaves as a shallow donor. Negligible carrier compensation by oxygen (O) in Al0.77Ga0.23N:Si layers was observed, suggesting that at such Al content, O does not seem to hinder the n-type doping in the material. In paper 2, we found the coexistence of two Si DX centers, the stable DX1 and the metastable DX2, in AlxGa1-xN for x≥0.84. For the stable DX1 center, abrupt deepening of the energy level of the negative charge state DX–, EDX, which determines the ionization energy Ea of the Si donor, with increasing of the Al content for x≥0.83 was observed. The dependence of Ea on the Al content in AlxGa1-xN:Si layers (0.79≤x≤1) was determined. The results explain the drastic decrease of the conductivity as often reported for  AlxGa1-xN:Si in previous transport studies. For the metastable DX2 center, we found that the EDX level remains close to Ed for x=0.84÷1. SiC is a wide band-gap semiconductor having high-thermal conductivity, high breakdown field, and large saturated electron drift velocity which are essential properties for high-voltage and high-power devices. In paper 3, the identification of niobium (Nb) in 4Hand 6H-SiC grown by high-temperature chemical vapor deposition (CVD) by EPR and theoretical calculations is presented. We showed that the incorporated Nb formed asymmetric split-vacancy defect (NbSiVC) in which Nb locates in a divacancy, closer to the Si vacancy, and prefers only the hexagonal-hexagonal configuration. In papers 4 and 5, we present the identification and the electronic structure of the negative-U Z1/Z2 center in 4HSiC. The Z1/Z2 defect is known to be the most common deep level revealed by Deep Level Transient Spectroscopy (DLTS) in 4H-SiC epitaxial layers grown by CVD. The center is also known to be the lifetime killer in as-grown CVD material and, therefore, attracts much attention. Using high-doped n-type free-standing 4H-SiC layers irradiated with low-energy (250 keV) electrons, which mainly displace carbon atoms creating C vacancies (VC), C interstitials and their associated defects, it was possible to increase the irradiation dose and, hence, the defect concentration, allowing the application of EPR and DLTS on the same samples. In paper 4, using EPR, photo-EPR, DLTS and capacitance-voltage measurements, we showed that the Z1/Z2 center is related to the (2-|0) level of VC and its higher-lying levels Z1 and Z2 are related to the (-|0) levels of VC at the hexagonal (h) and quasi-cubic (k) sites, respectively. In paper 5, combining EPR and supercell calculations, the negatively charged VC at the k-site was identified. We obtained the excellent agreement in the energy levels of Z1/Z2 determined by DLTS and energy levels of VC calculated by supercell calculations and observed clear negative-U behaviors of the negatively charged VC at both k and h-sites by EPR measurements, consolidating our assignment of the Z1/Z2 levels to the negatively charged states of VC. In paper 6, we studied a defect related to displaced C atoms in n-type 4H-SiC irradiated by low-energy electrons. In irradiated layers, we observed an EPR center at room temperature. After annealing at temperatures in the range of 300-500 °C, this center transforms to a second configuration which is observed in darkness and can be  changed back to the first configuration under illumination. Based on the observed 29Si and 13C hyperfine structures, two observed configurations of the EPR center were suggested to be related to different configurations of a carbon interstitial cluster. The annealing, bistable behaviors and energy levels of this EPR center are discussed.
机译:已知半导体材料中的点缺陷对电子设备的性能具有重要影响。对于缺陷控制,需要有关缺陷模型及其性质的知识。有关缺陷的信息,例如自旋的对称性和位置,对于识别缺陷和了解其电子结构至关重要。可以从电子顺磁共振(EPR)获得此类信息。在许多情况下,缺陷的能级可以根据光激发EPR(photo-EPR)或EPR信号的温度依赖性来确定。本文共六篇论文,着重结合EPR和其他电学特征以及密度泛函理论计算,对AlxGa1-xN(x〜0.7-1)和碳化硅(SiC)中的缺陷和杂质进行识别和电子结构研究。前两篇论文涉及AlGaN合金中硅(Si)的EPR研究。由于其直接和宽带隙可以从GaN的3.4 eV调整为AlN的6.2 eV,高铝含量的纤锌矿型AlxGa1-xN(x≥0.7)被认为是制造紧凑,高通量的有前途的材料高效,无毒的深紫外发光二极管(LED)和激光二极管(LD),用于在水/空气净化和消毒中替代低效率和有毒的汞灯。 Si通常用于AlGaN和AlN中的n型掺杂,但是据报道,在高Al含量下(x> 0.7),掺Si的AlxGa1-xN的电导率突然下降,并且经常推测其原因是当它从浅的施主转变为充当受主的DX(或负U)中心时,通过其他深能级或Si本身进行载流子补偿。在论文1中,我们表明Si已经在AlxGa1-xN中以x〜0.77形成了稳定的DX中心。然而,由于费米能级仅位于中性电荷状态以下〜3 meV,Ed,Si仍然表现为浅的施主。观察到Al0.77Ga0.23N:Si层中氧(O)对载流子的补偿可忽略不计,这表明在这样的Al含量下,O似乎不会阻碍材料中的n型掺杂。在论文2中,我们发现AlxGa1-xN中x≥0.84的两个Si DX中心(稳定DX1和亚稳DX2)共存。对于稳定的DX1中心,观察到负电荷态DX– EDX的能级突然加深,这决定了Si供体的电离能Ea,且x≥0.83时Al含量增加。确定了Ea对AlxGa1-xN:Si层(0.79≤x≤1)中Al含量的依赖性。结果解释了以前的运输研究中经常报道的AlxGa1-xN:Si电导率的急剧下降。对于亚稳态DX2中心,我们发现对于x = 0.84÷1,EDX级别仍然接近Ed。 SiC是具有高导热率,高击穿场和大饱和电子漂移速度的宽带隙半导体,这是高压和高功率器件的基本特性。在论文3中,提出了通过EPR鉴定通过高温化学气相沉积(CVD)生长的4Hand 6H-SiC中的铌(Nb)和理论计算方法。我们发现,掺入的Nb形成不对称的分裂空位缺陷(NbSiVC),其中Nb位于一个空位中,更接近Si空位,并且仅偏爱六边形-六边形构型。在论文4和5中,我们介绍了4HSiC中负U Z1 / Z2中心的识别和电子结构。众所周知,Z1 / Z2缺陷是通过CVD生长的4H-SiC外延层中的深层瞬态光谱(DLTS)所揭示的最常见的深层。该中心也被认为是成长中的CVD材料的终生杀手,因此备受关注。使用低能量(250 keV)电子辐照的高掺杂n型自支撑4H-SiC层,该层主要置换形成C空位(VC),C间隙及其相关缺陷的碳原子,可以增加辐照剂量和缺陷浓度,从而可以在同一样品上使用EPR和DLTS。在论文4中,使用EPR,光EPR,DLTS和电容电压测量,我们发现Z1 / Z2中心与VC的(2- | 0)水平有关,而其较高的Z1和Z2则与VC有关。分别在六边形(h)和准立方(k)位置的VC的(-| 0)水平。在论文5中,结合EPR和超级电池计算,确定了k位带负电荷的VC。我们通过DLTS确定的Z1 / Z2的能级和通过超级电池计算所计算的VC的能级获得了极好的一致性,并通过EPR测量在k和h位置观察到带负电荷的VC明显的负U行为,巩固了将Z1 / Z2电平分配给VC的带负电状态。在论文6中,我们研究了与低能电子辐照的n型4H-SiC中置换C原子有关的缺陷。在辐照层中,我们在室温下观察到一个EPR中心。在300-500°C的温度范围内退火后,此中心转变为在黑暗中观察到的第二种构型,并且可以在光照下变回第一种构型。基于观察到的29Si和13C超细结构,提出了两个观察到的EPR中心构型与碳间隙簇的不同构型有关。讨论了该EPR中心的退火,双稳态行为和能级。

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    Trinh, Xuan Thang;

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  • 年度 2015
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